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PCB Laser Direct Image HDI FPC 610mmx710mm ISO 9001

Categories Laser Direct Imaging PCB
Brand Name: GIS
Model Number: DPX630SM
Certification: ISO 9001 CE
Place of Origin: Jiangsu, China
MOQ: 1 set
Price: negotiable price
Supply Ability: 30set per month
Delivery Time: 20 work days
Packaging Details: wooden case packing
Name: laser Direct Imaging (LDI)
Application: PCB HDI FPC
Exposure Size Max: 610*710mm
Line Width: 50μm
Line Line Distance: 50μm
Line Width tolerance: 10%
Laser Type: LD Laser, 405±5nm
Deviation increase and decrease: Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment
File Format: Gerber 274X, ODB++
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PCB Laser Direct Image HDI FPC 610mmx710mm ISO 9001

laser direct imaging (LDI) system solutions PCB Solder Mask


Now it will be a matter of updating the design file as changing to the necessary image, which can be done more cost-effectively and consistently than traditional photo ways.

The laser direct image process typically goes as follows:

1. Coat resist on the copper laminate;

2. Exposing the photo of the PCB pattern on the resist;

3. Develop the unexposed resist;

4. Etch the exposed copper.


PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.


How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.


Specification/modelDPX230
ApplicationPCB,HDI,FPC (inner layer,outer layer,anti-welding)
Resolution (mass production)30um
Capacity30-40S@18"*24"
Exposure Size610*710mm
Panel thickness0.05mm-3.5mm
Alignment ModeUV-Mark
Alignment capabilityOuter layer±12um;Inner laye±24um
Line width tolerance±10%
Deviation increase and decrease modeFixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment
Laser typeLD Laser,405±5nm
File formatGerber 274X;ODB++
Power380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10%
ConditionYellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
Vibration requirements to avoid violent vibration near the equipment


About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.

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