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60mil Rogers 6035HTC Two Sided Pcb Ceramic Filled PTFE Composites

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-128.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Ceramic-filled PTFE composites
Layer count: Double Layer, Multilayer, Hybrid PCB
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish: Bare copper, HASL, ENIG, OSP etc..
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60mil Rogers 6035HTC Two Sided Pcb Ceramic Filled PTFE Composites


Dual Layer High Frequency PCB Made on Rogers 60mil RT/duroid 6035HTC With Green Mask for High Power RF Amplifiers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


RT/duroid 6035HTC high frequency circuit materials of Rogers Corporation are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications.


Features/Benefits:

1. High Thermal conductivity

Improved dielectric heat dissipation enables lower operating temperatures for high power applications


2. Low loss tangent

Excellent high frequency performance


3. Thermally stable low profile and reverse treat copper foil

Lower insertion loss and excellent thermal stability of traces


4. Advanced filler system

Improved drill ability and extended tool life compared to alumina containing circuit materials


Some Typical Applications:

1. High Power RF and Microwave Amplifiers

2. Power Amplifiers, Couplers, Filters

3. Combiners, Power Dividers



PCB Capability (RT/duroid 6035HTC)

PCB Material:Ceramic-filled PTFE composites
Designation:RT/duroid 6035HTC
Dielectric constant:3.50±0.05
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..

Data Sheet of RT/duroid 6035HTC

RT/duroid 6035HTC Typical Value
PropertyRT/duorid 6035HTCDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.50±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.6Z8 GHz - 40 GHzDifferential Phase Length Method
Dissipation Factor0.0013Z10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-66Zppm/℃-50 ℃to 150℃mod IPC-TM-650, 2.5.5.5
Volume Resistivity108MΩ.cmAIPC-TM-650, 2.5.17.1
Surface Resistivity108AIPC-TM-650, 2.5.17.1
Dimensional Stability-0.11 -0.08CMD MDmm/m (mils/inch)0.030" 1oz EDC foil Thickness after etch '+E4/105IPC-TM-650 2.4.39A
Tensile Modulus329 244MD CMDkpsi40 hrs @23℃/50RHASTM D638
Moisure Absorption0.06%D24/23IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃)19 19 39X Y Zppm/℃23℃ / 50% RHIPC-TM-650 2.4.41
Thermal Conductivity1.44W/m/k80℃ASTM C518
Density2.2gm/cm323℃ASTM D792
Copper Peel Stength7.9pli20 sec. @288 ℃IPC-TM-650 2.4.8
FlammabilityV-0UL 94
Lead-Free Process CompatibleYes

Quality 60mil Rogers 6035HTC Two Sided Pcb Ceramic Filled PTFE Composites for sale
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